SemiGen RF Supply Center

Automated PCB assembly with the experience to handle VGAs and mixed technology

For high-mix, low-to-medium volume printed circuit board assembly (PCBA) SemiGen is your automated and semi-automated expert, especially when the mix includes VGAs and/or mixed analog and digital technology. We help manufacturers of military electronics, commercial products, and medical instrumentation with their lead-less, fine-pitch, BGA, and QFP assembly requirements by offering an experienced team, a fully automated surface-mount MYDATA machine and a high temperature bake-in oven. We also offer additional through-hole manufacturing capabilities. So you can rest assured your boards will be delivered complete, on time and with the utmost quality.

SMT Assembly Capabilities

  • Lead less
  • Fine pitch
  • BGA
  • MicroBGA
  • QFP
  • LIDS
  • Diverse passive components

Full Range of Component Handling

SemiGen's automated PCB line can handle and place a full range of components on virtually any board. This includes everything from 0402 and CSP/FC components on up to complicated BGA- and QFP-types. With the trend towards miniaturization and odd-shaped components, it's essential to have a partner with an all-in-one machine.

Any size or shape PCBs

The ability to handle PCBs of any shape and size — from small boards to giant backplanes — is another key aspect to our flexible production. We can also easily switch between an in-line solution for larger batches and the specialized prototyping of smaller boards.

A Large Mix of Boards

Increasing demands in terms of board size and number of layers require a resource that can handle boards that are large and small, thick and thin. We can take on ultra-small boards or boards as large as 1117 x 812 mm (44" x 32") and as thick as 12.5 mm (1/2"). Odd-shaped boards can also be accommodated. And with MYDATA's Intelligent Surface Impact Control (ISIC), even placement on thin panels and warped boards is not a problem.

Production on Demand

Because our MYDATA machine is easily configured, we can set up for new components and respond to your needs as they arise.

Our Focus is on Throughput

Even the smallest of errors can slow down a manufacturing process. That's why our machine's operating software has features such as electrical verification and low feeder warning lights to ensure that new components are loaded correctly and ahead of time. Our machine picks components and performs electrical and dimensional verification in process, and rejects improper components while the board continues to be built.

While others may talk about their output per hour, SemiGen knows that in a high-mix environment, the only issue that matters is how many quality boards we've produced at the end of the day.

SMT Assembly
Capabilities:

  • Lead less
  • Fine Pitch
  • BGA
  • MicroBGA
  • QFP
  • LIDS
  • Diverse Passive Components