We have released our thin film circuit design guidelines. Designed to help RF, microwave, and millimeter-wave circuit design engineers with optimizing their layouts for our advanced ion beam milling (or etching) process, the layout tolerances and approaches [...] Read More

We have released a new Tech Brief "Leveraging the Precision of Ion Beam Milling Vs. Chemical Etching of Thin Film Circuits" that details the advantages to RF/microwave circuit designers of manufacturing their circuits using ion beam milling [...] Read More

We have announced the publication of a new Tech Brief “Eutectic Die-Attach of GaN and GaAs MMICs.”    The latest in RF/microwave GaN and GaAs MMIC circuit chips (die) are providing higher power levels than previous solid-state [...] Read More

SemiGen, Inc. announces a new Technical Brief, “Tips for Increasing Yields when Wire Bonding Small MESA Chips,” discussing the challenges of wire bonding to small MESA chips. This latest brief provides insights into the wire bonding process [...] Read More

The increased cost and complexity of designing, prototyping, assembling, troubleshooting, and redesigning modern RF/microwave assemblies that meet stringent government, military, and aerospace requirements is leading to a substantial growth in US-based [...] Read More